Mobiles,xbox360,ps2/3,Graphic Card,laptopetc chipset remove&replace ZM-R680D BGA Rework Station

bga rework station
bga repair machine
chipset remove&replace
touch screen+Camera+LCD+opimizer
hot air heaters&IR preheater

BGA Rework Station ZM-R680D

Specifications:

 

1	Power consumption	5.4 kW
2	Top heater	1200 W
3	Bottom heater	Infrared plate 3000 W - Nozzle 800 W
4	Power requirement	Single phase AC 220V ± 10% - 50 Hz 5.4 kVA
5	Dimensions	L 850 x W 650 x H 800 mm
6	Positioning	V-clip PCB clamping | 10~20 μm X-Y table adjust.
7	Temperature control	3 imported K-type thermocouple (Closed Loop)  ±3-5°C
8	Max. PCB size	430 x 400 mm
9	Min. PCB size	22 x 22 mm
10	Camera magnification	10x to 100x
11	Weight	85 kg

 

 

Features:

This touch screen controlled desktop rework station is the most compact of our high range equipment.With 3 high precision thermocouple, the temperature can be precisely controlled within a 3°C range by the PLC.With 7 programmable temperature zones, preheat, ramp up, reflow, solidification and cooling can be precisely adjusted.100 profiles can be recorded within the machine and flexibly created and modified through the touch screen interface.The CCD camera can simultaneously observe the component picked up by the nozzle and the pad on the PCB. The color sensitive focal positioning system can achieve a matching accuracy of 10 to 20 µm. The operator can supervise the process on a split screen 15 monitor.Heating and placing heads unique combined design, allows flawless placing and soldering. X,Y and Z axis are driven by step-motors. The software can remember 100 groups of coordinates.The upper and lower heating elements are controlled independently by the software. Pre heating the PCB with infrared plates can avoid deformation and guarantees precision of soldering.The high degree of automation achieved with this model minimizes the risk of human error. This equipment completely meets the requirements of lead-free process.