Mobiles,xbox360,ps2/3,Graphic Card,laptopetc chipset remove&replace ZM-R5850BGA Rework Station
bga rework station
bga repair machine
chipset remove&replace
touch screen+Camera+LCD+opimizer
hot air heaters&IR preheater
Technical parameters and characteristics:
A total power of 4700W
2 upper heating power 800W
3, the second temperature lower heating power 1200W, the third (IR) temperature 2700W
4 Power AC220V ± 10% 50/60Hz
5 dimensions 635 × 600 × 560mm
6, V-shaped positioning slot, PCB stent X, Y in any direction to adjust and configure the universal fixture
7 K-type thermocouple temperature control (K Sensor) closed-loop control, independent temperature control, accuracy up to ± 3 degrees;
8 PCB dimensions Max 410 × 370mm Min 20 × 20 mm
9 Weight 40kg
Technical parameters and characteristics:
1, using a linear slide so that X, Y, Z axis fine tuning can be done or rapid positioning movements with high accuracy and quick maneuverability;
2, machine uses high-precision temperature controller, built-in PC serial port, external temperature interface with software that enables computer-controlled;
3, with three independent heating temperature, the upper and lower temperature hot air heating, the bottom temperature infrared heating, precise temperature control within ± 3 degrees, the upper temperature zone to move freely as needed, the second temperature can be adjusted up and down, top and bottom heater can also set the multi-stage temperature control; IR preheating Available as per requirement to adjust the output power;
4, with a variety of specification alloy BGA nozzle, the nozzle can be rotated 360 degree, easy to install and replace, according to customer requirements;
5, the selection of high-precision K-type thermocouple loop control, external temperature measurement interface to the temperature of the sophisticated detection; PCB board positioning using V-shaped groove, flexible and convenient removable fixture on the PCB board has protective effects against PCB PCB edge of the device damage and deformation, and can adapt to a variety of BGA package size of the repair;
6, using high-power cross-flow fan to cool quickly PCB board to improve efficiency; and built-in vacuum pump, an external vacuum suction pen, convenient and quick to take hold BGA chips;
7, the welding work is completed with alarm function, as a user with special added "early warning" function; 8, the machine through the CE certification, with emergency stop switch and automatic power-off protection device abnormal accident; in the temperature control case, circuit can automatically power off, hold dual over-temperature protection.
